ENDODERMA
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IP & RECOGNITION
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Endoderma, with competitive stand alone and collaboratory R&D capabilities, will be a global leading company in TDDS and future technologies covering electroceuticals and DBO platform of microneedle manufaturing.
IP
No Patent No. Title of Patent Granted Nation
1 10-1831948
10-1831949
Microstructure Using Cross-linked Hyaluronic Acid Hydrogel
and Process For Preparing the Same
US JAPAN CHINA CANADA Malaysia UN(6)
2 10-1838715 Composition For Manufacturing Microneedle Comprising CrosslinkedHyaluronic
Acid and Non-crosslinked Hyaluronic Acid
3 10-1973801 Hyaluronic Acid Microstructure Having Excellent Dissolving Properties US JAPAN CHINA CANADA UN(38)
4 10-2064503 Microstructure For Transdermal Absorption and Process for Preparing the Same US JAPAN CHINA Malaysia CANADA UN(38)
RECOGNITION
Functional Cosmetics (Approval by KFDA)
eve VEGAN
Sanitary Approval from Chinese Authority
ENDODERMA Factory
Cerificate of Cosmetic Good Manufacturing Practice

  • CGMP
  • ISO22716
AWARDS
  • 2016 Awarded with Gold Medal Prize in the International Exhibition of Inventions Geneve
  • 2016 Awarded with Special Award Prize in the International Exhibition of Inventions Geneve
    (Association of Polish Inventions and Rationalizers)
2016 Awarded with Gold Medal / Special Award in the International Exhibition of Inventions Geneve
Endoderma's genuine microstructure was awarded with Gold Medal and Special Award (by Special Award of Association of Polish Inventions and Rationalizers) in the International Exhibition of Inventions Geneve
Intemational Exhibition of Inventions Geneve,Switzerland is the largest invention fair which takes place annually.
Endoderma's genuine microstructure uses cross-linked hyaluronic acid and is made into bio-degradable microstructure to create continuity, moisture improvement effect and wrinkle reduction effect on the skin of the body that last up to seven days.
Endoderma was awarded with Gold Medal and Special Award by gaining recognition for technology, feasibility and marketability in the International Exhibition of Inventions Geneve.